中图分类号： TN710
文献标识码： A
DOI：10.16157/j.issn.0258-7998.200903
中文引用格式： 张晓庆，刘德喜，祝大龙，等. DC-40 GHz通用化BGA封装的射频微系统测试技术研究[J].电子技术应用，2021，47(1)：2-6，10.
英文引用格式： Zhang Xiaoqing，Liu Dexi，Zhu Dalong，et al. Research on generalized testing technology of DC-40 GHz RF microsystem in BGA package[J]. Application of Electronic Technique，2021，47(1)：2-6，10.

Research on generalized testing technology of DC-40 GHz RF microsystem in BGA package

Abstract： The RF microsystem is the future development trend of electronic equipment miniaturization, and the ball grid array(BGA) is one of its common implementation forms. Because the BGA package cannot be measured by being connected to a vector network analyzer, the testing technology of the RF BGA package is studied. A test fixture that can be applied to the RF BGA package in DC-40 GHz is designed, and a series of cal-kits are designed for it, which solves the test problem for RF BGA package. The simulation results show that the return loss of the test fixture at work is more than 18 dB in DC-40 GHz. The return loss of the designed open-circuit cal-kit is less than 0.88 dB. The insertion loss of the through cal-kit and the line cal-kit are both less than 1.1 dB. The simulation results meet the designing requirements of calibration. The product has good electrical contact, and is solder-free, reusable, easy to process, and convenient to take and unload. It is universal for standard size BGA package.

Key words : ball grid array(BGA) package；RF test；through-reflect-line(TRL) calibration；cal-kits